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 dicing saws, wafer polishers and lappers! 
Equipment Exchange has the latest technology and most competitive prices in
dicing saws and more: wafer polishers, wafer lappers, mask aligners, surface measuring equipment, dicing saws, wafer inspection equipment, etchers, photoresist processing equipment and film thickness testers.Equipment Exchange has a complete line of wafer equipment such as dicing saws, wafer polishers, wafer lappers, mask aligners, surface measuring equipment, wafer inspection
equipment, etchers, photoresist processing equipment and more! We offer high-speed auto Disco dicing saws and K&S dicing saws. Our wafer polishers and grinders perform grinding and polishing for a
wide range of soft or hard materials. Our wafer lappers and mask aligners are top quality and this used equipment may come in a combination with wafer polishers, wafer lappers or wafer grinding
manufactured by Buehler, SpeedFam, Leco, Struers and more. Make accurate measurements with our mask aligners and surface measuring equipment, from fully automatic to manual load, manufacturers
include Inspex, Kla, Canon, Leitz, & Karl Suss. Some of our photoresist processing equipment includes photoresist coaters, developers and spinners.
Measure all of your standard films, silcon dioxide and nitride, negative and positive resists, nitrides, oxides, and polymides with film thickness testers such as ADE, Nanometrics, Veeco, Rudolph and Tencor.
We also have etchers, ashers and strippers available for all of your wafer equipment and wafer inspection equipment needs. Contact Equipment Exchange for more information about dicing saws,
wafer polishers, wafer lappers, mask aligners, surface measuring equipment, wafer inspection equipment, etchers, photoresist processing equipment and film thickness testers.
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