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wire and die bonders, bond pull testers! 
Quality selection of wire bonders and more – die bonders, bond pull testers, pick and place
systems, probe stations, wire bonders, burn in systems and marking machines.Equipment Exchange has a line of used semiconductor assembly equipment. Some of our equipment includes wire bonders, die
bonders, bond pull testers, pick and place systems, probe stations, burn in systems, and more! If your company assembles IC's and discrete devices or complex
hybrids, you may choose one of our automatic, manual wire bonders or die bonders. Wire bonders attach fine aluminum or gold wires to active devices. You can test the strength of your bond with bond
pull testers. With many different types of pick and place systems, automatically detect and pick up good die from probed and diced trays.
A selection of manufacturers for wire bonders, die bonders, and pick & place systems includes K&S, West Bonder, Laurier, Shinkana, and Viking.
Equipment Exchange has a large variety of probe stations to accommodate 2-inch, 4-inch and 6-inch wafers. Don't hesitate to ask about 8-inch wafers. Our selection includes manual or,
semi-automatic probers manufactured by Alessi Karl Suss, Micromanipucator, Rucker & Kolls, Signatone and Wentworth. After semiconductor assembly, you may cap your module and stamp
your mark with one of our marking machines manufactured by Markum. Choose Equipment Exchange for the highest quality semiconductor assembly equipment, including wire bonders, die bonders, bond pull
testers, pick and place systems, probe stations, burn in systems and marking machines.
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